Kiwi passports put to the test

The next-generation e-passports
introduced in 2009 now contain
enhanced security features that have
necessitated another stringent test
regime at IRL.

When the Department of Internal Affairs (DIA) introduced e-passports containing embedded microchips carrying the holder’s biometric information and digital photograph in 2005, IRL was called upon to build the instrumentation required to complete the testing and provide test procedures to evaluate prototype passports.

Specifications for durability testing of travel documents are defined by the International Civil Aviation Organisation (ICAO).

The next-generation e-passports introduced in 2009 now contain enhanced security features that have necessitated another stringent test regime at IRL involving accelerated UV conditions, thermal assessments and the effects of temperature, humidity, fatigue and tear strain.

IRL Engineering and Applied Physics project manager Diana Siew says the testing regime was a multidisciplinary effort involving materials chemistry, polymers and performance evaluation.

“Our materials testing area supports government initiatives to understand products that represent New Zealand. While the biggest challenge in this instance was the sheer volume of samples coupled with the stringent security issues, it was very satisfying to be able to work on a project that impacts directly on the New Zealand public.”

Matthew Seymour, DIA Passport Redevelopment Manager, says IRL’s services are key to the success of the project.

“IRL provides the DIA with external and independent assurance that the new generation of travel documents meet ICAO specifications and will stand the test of time,” he says.

“New Zealanders can be confident that when they go abroad, their passports will meet all the requirements on the world stage.”